laser direct imaging (LDI) system solutions LDI Flexible Board
Technical advantages of LDI
(1) LDI technology adopts laser positioning and vertical laser beam scanning, which can ensure that the graphic position deviation is within ± 5um, which greatly improves the line alignment accuracy and position.
(2) LDI technology does not use negative film, which can meet the production of very high-density fine conductors, improve the qualification rate of fine line PCB manufacturing and avoid repeated positioning defects.
(3) LDI technology does not need to manufacture, preserve and maintain photographic film devices, consumed materials, energy, other auxiliary materials, and chemicals, which reduces the production and processing cost.
(4) LDI technology can shorten the PCB manufacturing process, reduce the turnaround time, improve the rapid response-ability, reduce the intervention of human factors, simplify the operation process, and then improve the production efficiency.
PCB laser direct imaging (LDI)
When fabricating a circuit board, the circuit traces are defined by what is the imaging process. Laser direct imaging ( LDI ) exposes the traces directly with a highly focused laser beam that in NC controlled, instead of flooded light passing through a photo tool, a laser beam will digitally create the image.
How does laser direct imaging ( LDI ) work?
Laser direct imaging needs a PCB with the photo-sensitive surface that is positioned under a computer controlled laser. And then the computer is creating the image on the board with the light of laser. A computer scans the board surface into a raster image, matching the raster image to a pre-loaded CAD or CAM design file that includes the specifications for the necessary image intended for the board, the laser is used for directly creating the image on the board.
| Specification/model |
RTR315 |
| Application |
PCB,HDI,FPC (inner layer,outer layer,anti-welding) |
| Resolution (mass production) |
15um |
| Capacity |
12S@18"*24" |
| Exposure Size |
260*800mm |
| Panel thickness |
0.05mm-3.5mm |
| Alignment Mode |
UV-Mark |
| Alignment capability |
Outer layer±12um；Inner laye±24um |
| Line width tolerance |
±10% |
| Deviation increase and decrease mode |
Fixed increase and contraction, automatic increase and contraction, interval increase and contraction, partition alignment |
| Laser type |
LD Laser,405±5nm |
| File format |
Gerber 274X；ODB++ |
| Power |
380V three-phase alternating current, 6.4kW,50HZ, voltage fluctuation range + 7% ~-10% |
| Condition |
Yellow light room; Temperature 22°C ± 1°C; Humidity 50% ± 5%; Cleanliness level 10000 and above;
Vibration requirements to avoid violent vibration near the equipment |
About us
We are an innovative supplier of various PCB laser direct imaging (LDI) system solutions. Our system product portfolio ranges from LDI system configurations for high-mix and emerging PCB niche applications to fully automated LDI system solutions for mass production environments.
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0.05mm-3.5mm LDI Machine PCB HDI FPC ISO 9001 Images
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